Camille Chism, CPP Fellow, has 30 years of diverse experience in leadership, packaging engineering, management, design, business development, supply chain management, lean manufacturing, warehousing, design, test methodology, project management, and logistics in the industries of automotive, distribution, food, pharmaceutical, and technology.
Her experience includes a variety of industries including automotive, food, distribution, pharmaceutical, and technology at: Ingersoll Rand, Johnson Controls, Fiat Chrysler, Weyerhaeuser, Hewlett-Packard, Lucent Technologies, UPS, ConAgra, HAVI, and Mondelez.
Camille has been actively involved in IoPP (Institute of Packaging Professionals), since 1990, as a National Board Member, National VP of Chapters, Michigan Chapter President and Secretary, as well as a charter member of the Midlands (NE) chapter. She has also actively participated in AIAG (Automotive Industry Action Group) as Yard Committee lead, summit volunteer, member of various whitepaper committees, and a speaker.
A lifetime CPP, inducted into the IoPP College of Fellows in 2013, Camille received an MS in Packaging Science from Rochester Institute of Technology, earning a 4.0 GPA, holds a BS in Packaging from Michigan State University. Her accomplishments include; a patent for the design of an injection molded dispenser, various corporate awards, and leadership training from Cardinal Stritch University.
Camille has been active in industry events, including speaking at the 2010 IoPP Packaging Summit, participating in panels, forums, and committees for the Automotive Industry Action Group, speaker for the Simposio Internacional Industria Automotriz, Automotive Logistics Global Conference, Global SCM Leaders Conference, and as a guest lecturer in the Industrial Engineering Department at the University of Nebraska, Lincoln.
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